Product Details Portlet

XR3G Shrink IC Sockets

IC Socket for Shrink ICs.

  • IC socket designed exclusively for shrink ICs with 1.778-mm contact pitch.
  • Round-pin types for long life and good for shock and vibration durability.
  • No flux rise.
RoHS適合
Model 2D/3D CAD
XR2A-0801-N Download
XR2A-0805 Download
XR2A-1401-N Download
XR2A-1405 Download
XR2A-1601-N Download
XR2A-1605 Download
XR2A-1801-N Download
XR2A-1805 Download
XR2A-2001-N Download
XR2A-2005 Download
XR2A-2201-N Download
XR2A-2205 Download
XR2A-2401-N Download
XR2A-2405 Download
XR2A-2461-N Download
XR2A-2465 Download
XR2A-2471-N Download
XR2A-2475 Download
XR2A-2801-N Download
XR2A-2805 Download
XR2A-3201-N Download
XR2A-3205 Download
XR2A-4001-N Download
XR2A-4005 Download
XR2A-4201-N Download
XR2A-4205 Download
XR2A-4801-N Download
XR2A-4805 Download
XR2A-5001-N Download
XR2A-6401-N Download
XR2A-6405 Download
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No. of
contacts
Sockets with 0.25-μm gold plating Sockets with 0.75-μm gold plating
28 XR3G-2811 XR3G-2801
32 XR3G-3211 XR3G-3201
42 XR3G-4211 XR3G-4201
52 XR3G-5211 XR3G-5201
64 XR3G-6411 XR3G-6401
Rated voltage 1 A
Rated current 150 VAC
Contact resistance 20 mΩ max. (at 20 mV, 100 mA max.)
Insulation resistance 1,000 MΩ min. (at 500 VDC)
Dielectric strength 500 VAC for 1 min (leakage current: 1 mA max.)
Insertion force 3.92 N max. (with test gauge, 0.432 mm dia.)
Removal force 0.64 N min. (with test gauge, 0.432 mm dia.)
Insertion durability 100 times (with 0.75-μm gold plating)
50 times (with 0.25-μm gold plating)
Ambient operating temperature - 55 to 125℃ (with no condensation or icing)
(unit: mm)

XR3G-64□1(With DIP terminals)
○○:1


XR3G-28□1
XR3G-32□1
XR3G-42□1
XR3G-52□1
(With DIP terminals)

○○:1

Mounting holes (bottom view)
○○:2
Dimensions
No. of
contacts
Dimensions (mm)
A B C D E
28 10.16 12.7 23.114 25.7 5.6
32 10.16 12.7 26.670 29.2 5.6
42 15.24 17.8 35.560 38.1 10.7
52 15.24 17.8 44.450 47.0 10.7
64 19.05 21.6 55.118 57.7 14.5

Correct Use

Soldering

·When soldering, make sure that the outer sleeve of the IC Socket does not stick out of the circuit board through-holes.

·Make sure that no flux enters the IC Socket from the top.

Automated Soldering Conditions (Jet Flow)

1. Soldering temperature: 250 ±5℃
2. Continuous soldering time: Within 5 s