Product Details Portlet

G3VM-21MT MOS FET Relay Module

MOS FET Relay in module package with very low leakage current

  • Contribute to reduce the mounting space on the print circuit board by small package
  • Current leakage when the main line is open and sub line is close :1 pA (Maximum) at VOFF =20 V
  • Contact form: 1a (SPST-NO) + T-switch function
  • Surface-mounting
RoHS適合
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PackageContact
form
TerminalsLoad voltage
(peak value) *
Continuous
load current
(peak value) *
Tape cut packagingTape packaging
ModelMinimum
package quantity
ModelMinimum
package quantity
Module1a
(SPST-NO)
Surface-
mounting
Terminals
20V200mAG3VM-21MT1 pc.G3VM-21MT(TR01)100 pcs.
Note: 1. To order tape packaging for Relays with surface-mounting terminals, add "(TR01)" to the end of the model number. Tape-cut packaging are packaged without humidity resistance. Use manual soldering to mount them. Note: 2. 500 pcs./reel packing is also available. Please contact your OMRON sales representative. *The AC peak and DC value are given for the load voltage and continuous load current.
■Absolute Maximum Rating(Ta=25℃)
ItemSymbolG3VM-21MTUnitMeasurement conditions
InputLED forward current for main controlIF Main30mA
LED forward current for sub controlIF Sub30mA
LED forward current reduction rateΔIF/℃-0.3mA/℃Ta≧25℃
LED reverse voltageVR5V
Connection temperatureTj125
OutputLoad voltage (AC peak/DC)VOFF20V
Continuous load current (ACpeak/DC)IO200mA
ON current reduction rateΔIO/℃-2mA/℃Ta≧25℃
Pulse ON currentIOP600mAt=100ms、Duty=1/10
Connection temperatureTj125
Dielectric strength between I/O *VI-O500VrmsAC for 1 min
Ambient operating temperatureTa-40 to 110With no icing or condensation
Ambient storage temperatureTstg-40 to 125
Soldering temperature-26010s
*The dielectric strength between the input and output was checked by applying voltage between all pins as a group on the input (LED) side and all pins as a group on the output side (MOSFET).

■Electrical Characteristics(Ta=25℃)
ItemSymbolMinimumTypicalMaximumUnitMeasurement conditions
InputLED forward voltage for main controlVF Main2.22.542.8VIF Main=10mA
LED forward voltage for sub controlVF Sub1.11.271.4IF Sub=10mA
Capacitance between main control terminalsCT Main-15-pFV=0、f=1MHz
Capacitance between sub control terminalsCT Sub-30-V=0、f=1MHz
Trigger LED forward currentIFT Main/Sub--3mAIO=100mA
Release LED forward currentIFC Main/Sub0.1--IOFF=10uA
OutputMaximum resistance with output ONRON-812ΩIF Main=5mA、t < 1s
IO=200mA
Current leakage when the main line is open and
sub line is close *1
ILEAK--1pAVDD=20V*1
Capacitance between terminalsCOFF-0.61pFV=0、f=1MHz
Capacitance between I/O terminalsCI-O-1-
Insulation resistance between I/O terminalsRI-O1000108-VI-O=500VDC、ROH≦60%
Main line Turn-ON timetON Main--0.3msVDD=10V、IF Main=5mA、RL=200Ω*2
Main line Turn-OFF timetOFF Main--0.3
Sub line Turn-ON timetON Sub--0.3VDD=10V、IF Main=5mA、IF Sub=5mA、RL=200Ω*3
Sub line Turn-OFF timetOFF Sub--0.3
*1. ILEAK measurement condition
 ILEAK measurement condition
 
*2. Turn-ON and Turn-OFF Times (Main line)
 Turn-ON and Turn-OFF Times (Main line)
*3. Turn-ON and Turn-OFF Times (Sub line)
 Turn-ON and Turn-OFF Times (Sub line)


■Recommended Operating Conditions
For usage with high reliability, Recommended Operation Conditions is a measure that takes into account the derating of Absolute Maximum Ratings and Electrical Characteristics.
Each item on this list is an independent condition, so it is not simultaneously satisfy conditions.
ItemSymbolMinimumTypicalMaximumUnit
Load voltage (AC peak/DC)VDD--16V
Operating LED forward currentIF57.520mA
Continuous load current (AC peak/DC)IO--200
Ambient operating temperatureTa-20-85


■Connection Example 1
●Device Functional Modes *
CircuitControlMOS FET RELAY
A, C (Main line)
MOS FET RELAY
B (Sub line)
ONHONOFF
OFFLOFFON
--OFFOFF
*H: Optional setting, L: 0 V, X: don't care

●Timing Diagram
 Timing Diagram
*This products is recommended to use with dry switching
(No Load & No Source when switching) for prevent short circuit happening.
●Measurement Circuit
 Measurement Circuit
Note: The number from 1 to 6 are the pin numbers in the image shown here.


■Connection Example 2
●Device Functional Model*
IF MainIF SubMOS FET RELAY
A, C (Main line)
MOS FET RELAY
B (Sub line)
HLONOFF
LHOFFON
LLOFFOFF
*H: Optional setting, L: 0 V, X: don't care

●Timing Diagram
 Timing Diagram
*BothMOSFETrelayA,CandMOSFETrelayBmaybeONatthesame time.
For that reason, even if pins 4, 5 and 6 are all connected,
please design the circuit so that the equipment does not occur the damage.
 
●Measurement Circuit
 Measurement Circuit
(Unit: mm)
Surface-mounting Terminals
Weight: 0.11 g

 
Surface-mounting Terminals
Note: The actual product is marked differently from the image shown here.
Actual Mounting Pad Dimensions
(Recommended Value, Top view)

 Actual Mounting Pad Dimensions
Unless otherwise specified, the dimensional tolerance is ± 0.1 mm.

●Appearance
Appearance
Note 1. The actual product is marked differently from the image shown here.
Note 2. "G3VM" does not appear in the model number on the Relay.

●Terminal Arrangement/Internal Connections (Top view)
Terminal Arrangement/Internal Connections

Precautions for Safe Use

  • (1) Do not apply overvoltages or overcurrents to the input or output circuits of the product.
    The product may fail or ignite.
  • (2) Perform soldering and wiring correctly according to specified soldering conditions.
    Using a product with incomplete soldering may cause overheating when power is applied, possibly resulting in burning.

Precautions for Correct Use

●Derating
You must consider derating to achieve the required system reliability.
To use a product with high reliability, consider derating the maximum ratings and recommended operating conditions, and allow sufficient leeway in designs based on testing operation in the actual application under the actual operating conditions whenever possible.

  • (1) Maximum Ratings
    The maximum ratings must never be exceeded even instantaneously. This applies individually to each of the ratings. If any of the maximum ratings is exceeded, the internal parts of the product may deteriorate or the chip may be destroyed. To ensure high reliability in using a product, sufficiently derate the maximum voltage, current, and temperature ratings when designing the application.
  • (2) Recommended Operating Conditions
    The recommended operating conditions are to ensure that the product turns ON and OFF reliably.
    To ensure high reliability in using a product, consider the recommended operating conditions when you design the application.
  • (3) Fail-safe Design
    We recommend that you implement fail-safe measures in the design of the application if the failure of, deterioration of characteristics in, or functional errors in the product will have a serious affect on the safe operation of the system.

●Countermeasures for static electricity
There is a risk of damage to internal elements and impairment of functionality if static electricity is discharged to the pins due to product handling or otherwise.
Reduce the generation of static electricity as much as possible, and implement appropriate measures to prevent charge accumulation near the product.

●Typical Product Driving Circuit Examples
The LED input side of the MOS FET is driven by current. If applying a Voltage, add resistance in series with the circuit, so the specified current is applied.
This resistance is referred as "LED current limiting resistance".

C-MOS

Transistor

  • ・To ensure that the product operates correctly, usethe following formula to calculate the limiting resistance, and design the circuit accordingly.
  • R1=VCC-VOL-VF(ON)/IF
  • Note: To set the value of IF(ON), check the trigger LED current and recommended operation LED forward current indicated in the catalogue for each model, and set a high value with leeway.
  • ・To ensure that the product resetsreliably, calculate the reset voltage using the formula below, and control so that the voltage is lower than this value.
  • VF(OFF)=VCC=IF(OFF)R1-VOH
  • Note: For the IF(OFF) value, set a value that is lower with leeway than the reset LED forward current indicated for each model in the catalogue.
  • ・If the drive transistor has alarge leakage current that may cause malfunctioning, add a bleeder resistance.

●Protection from Surge Voltage on the Input Pins

  • ・If any reversed surge voltage is imposed on the input pins, insert a diode in parallel with the input pins as shown in the following circuit diagram and do not impose a reversed voltage of 3 V or higher.

Surge Voltage Protection Circuit Example

●Protection from Spike Voltage on the Output Pins

  • ・If there is an inductive load or other condition that will cause overvoltage that exceeds the absolute maximum rating between the output pins, connect a protective circuit to limit the overvoltage.

Spike Voltage Protection Circuit Example

●Load Connection

  • (1) Do not short-circuit the input and output pins while the product is operating or it may malfunction.
  • (2) Do not connect the input and output in reverse.
  • (3) Do not construct a circuit so that overcurrent and burning occur if the 4, 5 and 6 pins are short-circuited.

●Transportation

  • (1) When transportation and installing the product, do not drop the product or subject it to abnormal vibration or shock. It may cause deterioration of product characteristics, malfunc- tion or failure.
  • (2) Avoid transportation in the following conditions as it may cause failure or deterioration of characteristics.
  • ・Circumstance subject to water or oil.
  • ・Circumstance subject to high temperature or high humidity.
  • ・Circumstance where the temperature changes radically and condensation occurs.
  • ・State the product is not packed.

●Cleaning Flux from the products

  • (1) Clean flux from the product so that there will be no residue of reactive ions, such as sodium or chlorine.
    Some organic solvents will react with water to produce hydrogen chloride or other corrosive gases, which may cause deterioration of the products.
  • (2) When washing off the flux with water, make sure that there will be no residue of reactive ions, particularly sodium or chlorine.
  • (3) During water washing, do not scrub the marks on the surface of the product with a brush or your hand while there is clean- ing liquid on the product. The marks may come off.
  • (4) Clean the flux from the products with the chemical action of the solvent for submersed cleaning, shower cleaning, or steam cleaning. To minimize the effect on the products, do not place the product in the solvent or steam for more than 1 minute at a temperature of 50°C.
  • (5) If you use ultrasonic cleaning, keep the time short. If the cleaning time is too long, the sealing characteristics of the molded resin and frame materials may deteriorate.
    The recommended basic conditions are given below.
    Recommended Conditions for Ultrasonic Cleaning:
    Frequency: 27 to 29 kHz
    Ultrasonic wave output: 300 W max. (0.25 W/cm2 max.)
    Cleaning time: 30 s max.
    Also, suspend the products in the cleaning solution so that the product and PCB do not come into direct contact with the ultra- sonic transducer.
  • (6) Dry thoroughly after washing so that there is no residue of washing liquid.

●Solder Mounting

  • Perform solder mounting under the following recommended conditions to prevent the temperature of the MOS FET Relays from rising.

(Lead-free solder) SnAgCu recommended profile

  • Note 1. We recommend that you verify the suitability of solder mounting under actual conditions.
  • Note 2. When product is ordered with (TR01), tape package product is deliv- ered in moisture-proof packaging. If ordered without (TR01), tape-cut product is delivered in non moisture-proof packaging. Mount a tape cut product by manual soldering. Tape cut products absorb moisture be- cause a non moisture-proof package is used. Risk of package cracking or other damage due to thermal stress if reflow soldering is performed.
Manual Soldering (Once Only)
Perform manual soldering at 260°C for 10 s or less.

●Storage Conditions

  • (1) Store the products where they will not be subjected to water leaks or direct sunlight.
  • (2) When transporting or storing the product, observe all precautions on the packaging boxes.
  • (3) Keep the storage location at normal temperature, normal humidity, and normal pressure. Guidelines for the tempera- ture and humidity are 5 to 35°C and a relative humidity of 45% to 75%.
  • (4) Do not store the product in locations that are subject to corro- sive gases, such as hydrogen sulfide gas, or to salt spray, and do not store them where there is visually apparent dust, iron powder or dirt.
  • (5) Store the product in a location that has a relatively stable temperature. Radical changes in temperature during storage will cause condensation, which may oxidize or corrode the leads and interfere with solder wetting.
  • (6) If you remove products from the packages and then store them again, use storage containers that have measures to prevent static electricity.
  • (7) Do not under any circumstances apply any force to the prod- ucts that would deform or alter them in any way.
  • (8) This product is warranted for one year from the date of pur- chase or the date of delivery to the specified location.
    If the products are stored for more than about one year under normal conditions, we recommend that you confirm solder- ability before you use the products.

●Usage Conditions

<Mounting>
Do not install the product with oil or metal powder. This may cause insulation deterioration.
<Temperature>
The electrical characteristics of the products are limited by the application temperature.
If you use them at temperatures outside of the operating temperature range, the electrical characteristics of the products will not be achieved and the products may deteriorate. For that reason, you must determine the temperature characteristics in advance and apply derating* to the design of the application. (*Derating reduces stress.) Consider derating in the operating temperature conditions and apply the recommended operating temperature as a guideline.
<Humidity>
f the products are used for a long period of time at high humidity, humidity will penetrate the products and the internal chips may deteriorate or fail. In systems with high signal source impedance, leaks in the board or leaks between the leads of the products can cause malfunctions. If these are issues, consider applying humidity-resistant processing to the surfaces of the products. On the other hand, at low humidity, damage from the discharge of static electricity becomes a problem. Low humidity may cause damage due to electrostatic discharge. Unless moisture proofing is implemented, use within a relative humidity range of 40 to 60%.
<Replace>
Be sure to turn off the power when replacing parts. There is a risk of electric shock.
<Disposal>
This product uses GaAs (Gallium arsenide). Because the powder and substance are harmful to the human body, do not destroy, cut, crush or disassemble chemically.

●Considerations when handling Products

<Moisture proof package, MSL5>
Surface mount products may have a crack when thermal stress is applied during surface mount assembly after they absorb atmospheric moisture. Therefore, please observe the following precautions.
  • (1) This moisture proof bag may be stored unopened within 12 months at the following conditions.
    Temperature: 5°C to 30°C
    Humidity: 90% (Max.)
  • (2) After opening the moisture proof bag, the devices should be assembled within 48 hours in an environment of 5°C to 30°C / 60%RH or below.
  • (3) If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 48 hours, but perform baking only once.
    Baking conditions: 120±5°C. For 72 hours.
    Expiration date: 12 months from sealing date, which is imprinted on the label affixed.
  • (4) Repeated baking can cause the peeling strength of the tap- ing to change, then leads to trouble in mounting. Further- more, prevent the devices from being destructed against static electricity for baking of it.
  • (5) If the packing material of laminate would be broken the her- meticity would deteriorate.
    Therefore, do not throw or drop the packed devices.
  • (6) Tape-cut products are packaged without humidity resistance. Use manual soldering to mount them. (MSL not supported)