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New Technology

At world R&D Headquarters in Kyoto, Japan, Omron creates new smart technologies (as seen in compact, lightweight, easy, efficient, fast, and optimal solutions) that, unlike conventional sensing technologies, are not limited strictly to data input function, but rather integrate the areas of sensing & control to output high-value information for subsequent human or system processing. This sensing & control expertise forms the concept for the core technologies that have paved the way for many of OMRON's unique and advanced technologies.

Capacitive Touch Sensing ICs

New B6TS Sensing ICs Simplify Touch Control Applications

  • Fast development time, due to application and self-teach programsB6TS is the key component for designing highly flexible, responsive and reliable capacitive touch sensing controls.
  • Measures floating capacitance through most touch panel materials
  • Features high noise immunity and automatic drift compensation

OMRON announces production availability of a new Touch Sensing IC family.

The B6TS is the key component for designing highly flexible, responsive, and reliable capacitive touch sensing controls.
Designed to integrate easily and quickly with any capacitive touch interface, the new Omron B6TS allows for a much shorter design cycle than that of other sensor ICs and it's development software permits the flexible sensing chip to be "application ready".  Other quick development features include self-teaching, auto threshold, and intelligent filtering, in order to simplify system design and improve performance. The B6TS compensates continuously for long term drift, to help ensure a long service life, and is designed to be more resistant to EMC interference.

For full product information and complete set of technical details - please click on the image and visit our corporate website:

Ultra-Wideband Antenna
Omron releases World's first mass-producible polymeric Ultra-Wideband Antenna.

Optimizing data transmission between PCs & other digital home appliances

Combines compact size with high performance utilizing OMRON's proprietary
  dielectric polymer molding technology

UWB

Official Press Release

Visit Omron's Corporate site for Additional Product Information!

Semiconductor Micro Fabrication Technology

In contrast to the two-dimensional structure of integrated circuits, MEMS technology produces three-dimensional semiconductor structures with sub-micrometer precision. These smart structures yield ultra-compact, ultra-fast devices that help OMRON develop optimal new forms of sensing & control for the new age.

Ultra-compact Sensing MEMS

As with trends in electronic equipment everywhere, demands for miniaturization have been placed on sensors for detecting gas and fluid pressure, which are incorporated into air conditioners and electronic sphygmomanometers. Omron has been working on electrostatic pressure and acceleration sensors since long before this demand arose.

These sensors detect the minute change in electrostatic capacity between a moving electrode and a fixed electrode as it changes under pressure. Conventional sensors could not be physically miniaturized without sacrificing sensitivity. Omron solved the problem by employing a specially developed donut diaphragm structure to attain the high output linearity necessary for accurate detection. At one-tenth (2.5 mm2) the size of conventional products, it offers the world's highest sensitivity in an ultra small package.

High-Precision Processing - Electroforming

Electroforming is widely used where the mechanical process is not practical due to high resolution and precision requirement. It copies superfine and complex pattern accurately.

What is electroforming?
When thick plating is done to the surface of the mother die and the electrodeposited layer flaked off, the shape which is quite opposite to the mother die is obtained.

Usage
    1. The size accuracy is extremely high, and it is steady. The dimensional error of the reproduced goods is within ±1µm over 100mm, moreover, the distortion of the surface is 50µm or less.
    2. The defect caused by foreign body is extremely few because of the clean room production.
    3. The side can be transcribed in high accuracy. Moreover, if the matrix is a mirror finish, it is possible to use as a mirror finish without the finish processing. 4) Because the material is a nickel, hardness is high and durability is sufficient. It is possible to use as a mold for molding meta

    Usage
    1. Metal mold for liquid crystal display optical guided-wave devices and metal mold for non-spherical micro lens
    2. Metal mold for micro Fresnel lenses
    3. Stamper for optical disks such as CD and DVD
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